SBB830-QTY25

SBB830-QTY25

Pengeluar

Chip Quik, Inc.

kategori Produk

papan prototaip berlubang

Penerangan

830 PTS SOLDER-IN BREADBOARD (EX

Spesifikasi

  • siri
    Proto-Advantage
  • pakej
    Bulk
  • status bahagian
    Active
  • jenis papan proto
    Breadboard, General Purpose
  • penyaduran
    Plated Through Hole (PTH)
  • padang
    0.1" (2.54mm) Grid
  • corak litar
    5 Hole Pad (Single Side)
  • kenalan tepi
    -
  • diameter lubang
    0.039" (1.00mm)
  • saiz / dimensi
    6.60" L x 2.30" W (167.6mm x 58.4mm)
  • ketebalan papan
    0.063" (1.60mm)

SBB830-QTY25 Permintaan Sebutharga

Dalam stok 1595
Kuantiti:
Harga Unit (Harga Rujukan):
82.79000
Harga sasaran:
Jumlah:82.79000